Qorvo® To Unveil New RF Solutions at Mobile World Congress 2017

Qorvo’s RF solutions improve device performance and optimize spectral efficiency to accelerate the global adoption of next-generation wireless standards

GREENSBORO, NC – February 22, 2017 – Qorvo® (Nasdaq:QRVO), a leading provider of innovative RF solutions that connect the world, today announced it will showcase its expanding portfolio of radio frequency (RF) solutions at Mobile World Congress (MWC) 2017 in Barcelona. Qorvo offers a breadth of RF solutions unmatched in the industry, from highly integrated power amplifiers, filters, multiplexers and switches to antenna tuners and other high-performance solutions for 4G LTE, LTE-A, pre-5G/5G and IoT applications.

As the growing demand for data and increasing carrier requirements for optimized spectral efficiency drive RF complexity, Qorvo is simplifying connectivity by solving the most critical RF challenges. A pioneer in RF for more than 30 years, Qorvo collaborates closely with the leading carriers, equipment manufacturers, channel partners and smartphone providers to maximize network capacity and accelerate the next generation of wireless networks and devices. During Mobile World Congress 2017, Qorvo will highlight new RF solutions including its high performance RF Fusion™ portfolio, the adaptable and scalable RF Flex™ portfolio and an expanding portfolio of multiplexers and other solutions optimized to solve advanced carrier aggregation (CA) challenges.

Qorvo’s high-performance RF solutions simplify design, reduce product footprint, conserve power, improve system performance and accelerate the adoption of carrier aggregation. Qorvo combines systems-level expertise, broad manufacturing scale, and the industry’s most comprehensive product and technology portfolio to help leading manufacturers accelerate the delivery of next-generation 4G LTE, LTE-A, pre-5G/5G and IoT products. Qorvo’s core RF solutions set the standard for next-gen connectivity, delivering unmatched integration and performance at the heart of the connected world.

Qorvo will showcase the industry’s most comprehensive portfolio of advanced RF Front End solutions at Mobile World Congress (MWC 2017), from February 27 through March 2 in Hall 2, Stand 2i25.

About Qorvo

Qorvo (NASDAQ:QRVO) makes a better world possible by providing innovative RF solutions at the center of connectivity. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including advanced wireless devices, wired and wireless networks and defense radar and communications. We also leverage our unique competitive strengths to advance 5G networks, cloud computing, the Internet of Things, and other emerging applications that expand the global framework interconnecting people, places and things. Visit www.qorvo.com to learn how Qorvo connects the world.

Qorvo is a registered trademark of Qorvo, Inc. in the U.S. and in other countries.

IDT and BAE Systems Win Electrons d’Or Award for Space-Grade Chip that Speeds Data Movement in Space

IDT and BAE Systems Win Electrons d’Or Award for Space-Grade Chip that Speeds Data Movement in Space

Contest Sponsor Electroniques Magazine Selected BAE Systems’ RADNET1848PS, Which is Built Upon IDT RapidIO Technology, as Winner in the Military/Aerospace Category

SAN JOSE, Calif., June 29, 2016 – Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI) announced today that a space-grade chip it developed with BAE Systems has won an Electroniques magazine Electrons d’Or Award for 2016. IDT’s RapidIO switch technology serves as the foundation for BAE Systems’ RADNET1848PS radiation-hardened microchip, which won the award in the military/aerospace category.  The chip is designed to help speed the movement of massive amounts of data through a network of radiation-hardened computer systems in outer space.

“Our RapidIO switch technology has a strong foothold in the communications industry and, with its low latency and high scalability, RapidIO is increasingly being used in the most data-intensive applications, such as data centers and high-performance computing,” said Ron Jew, general manager in IDT’s Computing and Communications Division. “Our work with BAE Systems demonstrates that these chips can deliver this same value even within the challenging environmental conditions of outer space.”

The awards ceremony took place in Paris on June 28.

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, timing, wireless power transfer, serial switching, interfaces and sensing solutions are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT is accessible at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, YouTube and Google+.

©2016, IDT. IDT and the IDT logo are trademarks or registered trademarks of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.


Finisar Introduces 25G Ethernet Optics for High Speed Data Centers and Drives Definition of PAM4 Optics Technology During OFC 2016

Finisar Introduces 25G Ethernet Optics for High Speed Data Centers and Drives Definition of PAM4 Optics Technology During OFC 2016

Finisar Will Also Demonstrate Optical Test Equipment Including WaveShaper and UltraSpan Products

SUNNYVALE, CA — (Marketwired) — 03/22/16 — Finisar (NASDAQ: FNSR) today announced several optics products and technology demonstrations to be held this week during the OFC exhibition. The company will showcase two new products for 25GbE data center applications including an SFP28 eSR transceiver enabling 300-meter links over existing OM3 MMF, and 25G SFPwire®, an Active Optical Cable (AOC) with embedded technology that provides real-time troubleshooting and link performance monitoring. Finisar will also demonstrate optics technology supporting the PAM4 modulation format for Ethernet interfaces at 50 Gb/s per lane. See these demonstrations, including the latest test equipment products, in Finisar’s booth 2305 at the Anaheim Convention Center in Southern California.

25GE SFP28 eSR Transceivers for Data Centers

During OFC, Finisar will feature its SFP28 eSR (extended short reach) transceiver in a demonstration targeting 25G Ethernet data center applications. The new optical module extends links from 70 to 300 meters over existing OM3 multimode fiber (MMF) and enables a seamless upgrade from installed 10GE fiber plant to 25GE. It leverages in-house vertically integrated optics and IC’s and interoperates with current 25GE SFP28 SR and QSFP28 SR4 modules.

The demonstration will show the SFP28 eSR module transmitting 300 meters over OM3 MMF in compliance with the same specification as the 25GE SR module, per the IEEE standard. With this product, customers are able to utilize existing, deployed fiber infrastructure, while increasing network bandwidth by 2.5x over existing 10GE networks, saving significant capital expense.

25G SFPwire AOC with Connectivity Diagnostics

The 25G SFPwire® AOC is the ideal solution for intra- and inter-rack high speed data center interconnections. Designed for ease-of-use, 25G SFPwire® AOCs are lighter, more flexible and lower in power consumption than comparable Direct Attached Copper cables (DACs). Finisar’s VCSEL and IC technology deliver high signal integrity and reliable performance for error-free 25G connectivity. This allows customers the option to by-pass the host FEC, for non-standard, low-latency connections, which is not possible with comparable DACs.

The embedded Connectivity Diagnostics(TM) technology provides data centers with real-time performance monitoring of the 25G SFPwire AOCs, through both a host-software interface and physical indicators on the AOC pull-tabs. The only technology of its kind in the industry, Connectivity Diagnostics provides critical information used for troubleshooting, link performance monitoring and port-connectivity mapping.

The booth demonstration will show multiple 25G SFPwire® AOCs operating between two switches. Innovative Connectivity Diagnostics features will be demonstrated without affecting data traffic.

Driving the Definition of PAM4 Optics Technology

PAM4 is a modulation format that has been adopted by the Ethernet Standards for 50 Gb/s per lane signaling, and will become the building block for future 50GE, 100GE, 200GE and 400GE interconnects. PAM4 presents a significant and challenging transition for the optical interconnect industry, driving an industry-wide re-assessment of link budgets, optical components and transceivers in order to implement PAM4 optical technology in an open, standards-driven way.

Finisar is excited to lead the definition and development of PAM4 optical technology for both shortwave (SW, multimode) and longwave (LW, single mode) applications. The PAM4 Optical Technology demonstration, located in both Finisar and Ethernet Alliance booths, will showcase Finisar DML technology transmitting two channels of 50 Gb/s PAM4 on the CWDM grid over 10km of SMF. Hosted within Juniper and Spirent systems in the EA booth, this is the first interoperability demonstration using DML technology to transmit Nx50 Gb/s PAM4. Finisar DML technology, in both SW and LW implementations, will be critical for the success of PAM4 modulation especially in higher loss-budget implementations such as large data center interconnects with multiple patch-panels.

“Finisar is pleased to share our latest 25GE product innovation and PAM4 technology achievements with our customers at OFC,” said Todd Swanson, EVP of Global Sales & Marketing at Finisar. “We remain focused on developing a broad portfolio of optical technologies and leading-edge optical modules that our customers require to be successful in their end markets.”

Test Instrument Portfolio

Finisar is also demonstrating new capabilities of the WaveShaper® and WaveAnalyzerTM test equipment portfolio in combination with the UltraSpan® broadband source. The WaveShaper 16000S demonstrates broadcasting to 16 ports, each with individual amplitude and phase filtering. The WaveAnalyzer demonstrates triggered spectral measurements as they are required, for example, in a recirculating loop setup. These demonstrations are supported by Finisar’s new UltraSpan® broadband source which provides a powerful and flat ASE signal across the C-band.

About Finisar

Finisar Corporation (NASDAQ: FNSR) is a global technology leader for fiber optic subsystems and components that enable high-speed voice, video and data communications for telecommunications, networking, storage, wireless, and cable TV applications. For more than 25 years, Finisar has provided critical optics technologies to system manufacturers to meet the increasing demands for network bandwidth and storage. Finisar is headquartered in Sunnyvale, California, USA with R&D, manufacturing sites, and sales offices worldwide. For additional information, visit www.finisar.com.


Victoria McDonald
Director, Corporate Communications Finisar Corporation
+1 (408) 542-4261 press@finisar.com

Source: Finisar
News Provided by Acquire Media

IDT to Present Latest Sensing Technology at SENSOR+TEST 2016

SAN JOSE, Calif., April 26, 2016 – Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), announced today that it will exhibit its advanced sensing technology next month at SENSOR+TEST 2016 in Nurnberg, Germany. The company will showcase leading sensing products developed by ZMDI, a German company it acquired in December. The event, which runs May 10-12, takes place at the Nurnberg Exhibition Centre, and IDT will be at booth 5-217.

Products IDT will demonstrate include various environmental and automotive sensing solutions based on the latest standard IC developments, such as:

  • High-precision magneto resistive position sensors
  • High-temperature sensing product with a temperature range up to more than 1000°C
  • Arc fault detection for photovoltaic installation

IDT will also demonstrate mobile sensing products, including recently released products such as a UVA/UVB sensor and a UV and ambient light sensor, as well as sensing products that measure proximity, gas, humidity and barometric pressure.

SENSOR+TEST is a key event for anyone interested in sensing technology, and this year we will be demonstrating a wide array of high-performance, high-value products,” said Frantz Saintellemy, vice president of IDT’s Automotive and Industrial Division. “This technology is ideal for cutting-edge mobile products in the consumer, industrial, medical and automotive industry applications.”

During the event IDT will have technical and sales representation as well as senior executives in attendance. Attendees interested in meeting with an IDT representative can complete this short web form. IDT is also offering a free one-day ticket to the show which can be obtained here.

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, timing, wireless power transfer, serial switching, interfaces and sensing solutions are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT is accessible at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, YouTube and Google+.

IDT Wireless Power kit: Easing designer’s time to market

Integrated Device Technology, Inc. introduced wireless power kits plug-and-play, Qi-compliant transmitter and receiver reference kits to simplify designer integration. These two-layer boards use IDT’s wireless power IC solutions.

IDT is a leader in wireless power transmitter and receiver solutions for wireless charger applications, addressing all major standards and technologies with an extensive portfolio of standards-certified products. IDT has proven expertise in both magnetic induction and magnetic resonance technologies, and actively participates in the Wireless Power Consortium (WPC), Power Matters Alliance (PMA), and Alliance for Wireless Power (A4WP) as a board member.  The company has introduced a number of innovative  products that they claim as unique, including the first true single-chip transmitter, the highest-output-power single chip receiver, and the first dual-mode receiver IC compatible with both WPC and PMA standards.This choice of standards offers the designer a level of versatility not easily found in the industry.

In order to develop and integrate a robust wireless power design, designers need a certain level of expertise. That design prowess needs to be developed and takes time, especially in the broad market where companies run leaner with less engineers who need to learn expertise in different disciplines to design many varying types of circuits for their systems, which inherently  delays a product to market. IDT’s 5 Watt Wireless power reference design has the transmitter and receiver designs done with optimum PCB layout, minimum board space, extensive documentation, layout import files and as a bonus a Foreign Object Detection (FOD) tuning guide.

Designers will be able to more easily integrate Wireless power in systems such as PC peripherals, furniture, medical devices, and other portable devices still hindered by traditional contact-based charging bases or cables.

Qorvo Announces Second Edition of GaN For Dummies®

GREENSBORO, N.C. and HILLSBORO, Ore. – June 2, 2015 – Qorvo, Inc. (Nasdaq: QRVO), a leading provider of RF solutions for mobile, infrastructure and aerospace/defense applications, today announced a second edition of their “GaN For Dummies” books. Written in conjunction with publisher John Wiley and Sons, Inc., the books consist of two volumes, GaN RF Technology For Dummies® and RF Applications of GaN For Dummies®. This edition includes updates to Qorvo’s original GaN For Dummies books, which were published in 2014.

The GaN For Dummies books help technical and nontechnical professionals learn more about the basics of gallium nitride (GaN) in radio frequency (RF) technology and how they can use GaN in RF product designs. Both e-book volumes are free and available for download from the GaN For Dummies landing page on the Qorvo website.

GaN transistors were first demonstrated in the 1990s and now are widely available for commercial and defense applications. GaN’s popularity is based on the high power density and high efficiency it can achieve. Revenue for GaN RF devices in both military and commercial applications will grow at a compound average annual growth rate (CAAGR) of more than 20 percent to nearly $560m in 2019, according to Strategy Analytics.

“GaN technology is rapidly gaining traction for base transceiver stations (BTS), cable TV (CATV) and defense systems because it can meet the exacting performance requirements those applications demand,” said Dr. Douglas Reep, Qorvo’s Sr. Director of Research, Infrastructure and Defense Products. “GaN For Dummies provides company leadership, system engineers and designers with a short course introducing the benefits of GaN, illustrating its exceptional reliability and unique performance capabilities.”

Volume 1, GaN RF Technology For Dummies®, covers:

  • The key properties of GaN
  • What makes GaN FETs unique
  • How GaN compares to other semiconductor technologies
  • The thermal challenges of GaN
  • Ten important facts about GaN technology

Volume 2, RF Applications of GaN For Dummies®, includes:

  • How GaN benefits your system applications
  • Why and when to use GaN
  • Important design factors for GaN
  • GaN’s utility in multiple applications
  • Ten keys to success using GaN

About For Dummies®

After 20 years, more than 250 million copies printed, and millions of e-books downloaded, For Dummies is the world’s bestselling reference series, well known for enriching people’s lives by making knowledge accessible in a fun and easy way. Loyal customers around the globe agree that For Dummies is “more than a publishing phenomenon … [it is] a sign of the times,” [The New York Times]. With more than 1,800 active topics covering everything from health to history, music to math, sports to self-help, technology to travel, For Dummies is dedicated to Making Everything Easier. The For Dummies brand presence continues to expand wherever there is a need to know, including e-books, mobile apps, e-learning courses, a corporate custom publishing program, a robust consumer website and a licensed product line that includes consumer electronics, culinary, crafts, video, software, musical instrument packs, home improvement, automotive, game and more. For more information, visit Dummies.com. For Dummies is a branded imprint of Wiley.

About Qorvo

Qorvo (Nasdaq:QRVO) is a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications. Qorvo was formed following the merger of RFMD and TriQuint, and has more than 6,000 global employees dedicated to delivering solutions for everything that connects the world. Qorvo has the industry’s broadest portfolio of products and core technologies; world-class ISO9001-, ISO 14001- and ISO/TS 16949-certified manufacturing facilities; and is a DoD-accredited ‘Trusted Source’ (Category 1A) for GaAs, GaN and BAW products and services. For the industry’s leading core RF solutions, visit www.qorvo.com.

Katie Caballero
Marketing Communications Manager
Qorvo Infrastructure and Defense Products

Vitesse to Participate in The Benchmark Company Micro Cap Discovery Conference

CAMARILLO, Calif.–(BUSINESS WIRE)– Vitesse Semiconductor Corporation (Nasdaq: VTSS), a leading provider of IC solutions to advance “Ethernet Everywhere” in Carrier, Enterprise and Internet of Things (IoT) networks, will host one-on-one meetings with investors at The Benchmark Company Micro Cap Discovery Conference at The Palmer House Hilton in Chicago on December 11, 2014.

During the event, management will discuss the Company’s “Ethernet Everywhere” strategy that simplifies the transition to Ethernet for all network types with its differentiated technologies and new product line developed for this large growth market.

Attendees can contact their Benchmark representative or LHA to arrange a meeting. The applicable presentation will be accessible on the investor section of Vitesse’s website: www.vitesse.com.

About Vitesse

Vitesse (Nasdaq: VTSS) designs a diverse portfolio of high-performance semiconductor solutions for Carrier, Enterprise and Internet of Things (IoT) networks worldwide. Vitesse products enable the fastest-growing network infrastructure markets including Mobile Access/IP Edge, Cloud Computing, SMB/SME Enterprise and Industrial-IoT Networking. Visit www.vitesse.com or follow us on Twitter @VitesseSemi.

Vitesse is a registered trademark of Vitesse Semiconductor Corporation in the United States and other jurisdictions. All other trademarks or registered trademarks mentioned herein are the property of their respective holders.


Company Contact:
Vitesse Semiconductor
Marty McDermut, +1-805-388-3700

Marvell Launches Highly Integrated Quad-Core 64-bit

Marvell Launches Highly Integrated Quad-Core 64-bit ARMADA Mobile PXA1908 Platform for the Fast Growing 5-Mode 4G LTE Worldwide Mass Market

Marvell’s ARMADA Mobile PXA1908 platform features quad-core 64-bit ARM Cortex A53, efficient power management, integrated location and sensor technology, and field proven 5-mode 4G LTE modem technology


Sue Kim
Director, Corporate Communications and PR

Santa Clara, California (November 17, 2014) – Marvell (Nasdaq: MRVL), a worldwide leader in providing complete silicon solutions from mobile communications to storage, Internet of Things (IoT), cloud infrastructure, digital entertainment and in-home content delivery and Kinoma® software enabling the “Smart Life and Smart Lifestyle,” today announced the highly integrated quad-core 64-bit ARMADA® Mobile PXA1908 platform, extending its award-winning ARMADA Mobile product family. Targeted for the fast growing 5-mode 4G LTE worldwide mass market, Marvell’s cost optimized mobile processor features ARM Cortex A53, efficient power management, integrated location and sensor technology, and field proven 5-mode 4G LTE modem technology. The PXA1908 mobile processor maintains complete software compatibility with the octa-core ARMADA Mobile PXA1936, enabling OEMs and ODMs to quickly and seamlessly launch a higher performing octa-core mobile phone. The ARMADA mobile PXA1908 supports today’s most popular cellular communications including: TD-LTE, FDD-LTE, TD-SCDMA, WCDMA and GSM.

“Built upon our worldwide leadership and proven track record in enabling high performance, low power, and affordable 4G LTE smartphones since last year, I believe our new ARMADA Mobile PXA1908 will further empower global mobile operators and tier-one OEMs to quickly expand the 4G LTE market to entry-level smartphones and greatly accelerate its deployment to the mass market around the world. With PXA1908’s field-proven 5-mode 4G LTE modem, high level of integration, low power consumption, cost effective architecture and the 64-bit quad-core processor supporting the latest Android operating system, I believe Marvell has once again raised the technology bar,” said Weili Dai, President and Co-Founder of Marvell. “I’m very thankful for our global teams of talented engineers for their innovation, invention and dedication to continually leading the industry and delivering best-in-class mobile solutions.  At Marvell, it is our mission and passion to make the world a better place for all.”

The 64-bit quad-core 5-mode LTE system-on-chip (SoC) is designed to address the fast growing LTE market, enabling easy integration from 2G and 3G connectivity to 4G LTE. Marvell’s 64-bit family of mobile SoCs also pave the way for device makers to release 64-bit tablets and smartphones with the Android L operating system. Major smartphone vendors are expected to begin shipping products powered by Marvell’s PXA1908 globally in early 2015.

Key features of the Marvell ARMADA Mobile PXA1908 include:

  • Cost optimized quad-core Cortex A53, up to 1.2GHz clock speed
  • Improved image processing to support 8MP to 13MP camera
  • Advanced power management
  • Supports 720p display
  • Field proven DSDS software for 5-mode modem

To learn more about the Marvell PXA1908 processors, visit http://www.marvell.com/communication-processors

Strip Design and Development–Gaining Confidence in the Process

By: Brad Kuvin

Saturday, February 01, 2014

“We use simulation software differently than other tool builders might,” begins Jason Andras, design manager at Atlantic Tool & Die Co. (ATD), when asked to describe the firm’s recent uptick in inhouse die design and development. The 650-employee automotive-stamping and assembly company works out of numerous locations, including four in Ohio; plants in Texas and Mexico; a primary design and engineering center in Costa Rica; and a die-build, stamping and assembly shop in China. ATD’s facility in China produced 70 new stamping tools for ATD and other North American customers in 2013, generating $3.5 million. In 2014 it is projected to produce 100 to 120 new progressive dies generating $5 to $7 million.

We caught up with Andras, who oversees ATD’s die-design and development process, at its headquarters facility in Strongsville (Cleveland), OH. Up for discussion: its evolving use of 3D modeling and surfacing of dies and weld fixtures, based on its use of:

• VISI PC-based CAD-CAM software;

• Progressive-die strip simulation using the Dynaform suite of software modules; and

• Reverse engineering of cutting sections and forming details using a portable coordinate-measuring machine —a Faro ScanArm outfitted with a laser scanner.

ATD's Faro ScanArm portable coordinate-measuring machine
ATD’s Faro ScanArm portable coordinate-measuring machine, equipped with a laser scanner, captures surface data and enables reverse engineering of die surfaces—new trim edges, for example.

ATD launched its foray into 3D design and development—of stamping dies and of weld fixtures to support its secondary operations—in 2005. The goal, says Andras, was to develop expertise in stamping and assembling more complex parts and assemblies, such as large rear parcel shelves and tiny yet complex airbag housings.“While we’ve used VISI companywide for years primarily at our design center in Costa Rica,” says Andras, “we’re ramping up its use here in Cleveland as we look to retire various other software and consolidate to VISI. To supplement the eight seats of VISI in Costa Rica (two added in June of 2013), in the last two years we’ve acquired four VISI seats in Ohio (one at its Sharon Center plant, two seats in Strongsville and one in Texas), with more coming. One of the nice features of VISI our designers really appreciate is the ability to work in 2D and 3D—they can sketch in 2D and extrude in 3D, surface and model all in one. That’s been a great benefit.”

Accurate Simulation Starts with a Robust Material-Property Database

ATD’s ongoing design-software evolution also aims to improve its ability to accurately simulate new progressive-die strip models, and also to support weld-fixture development. Enter Dynaform, with modules for estimating blank size and predict thinning and thickening; create complete die-face models, including binder and addendum, from part geometry; simulate and validate die designs and identify problem areas, as well as optimize designs to reduce wrinkling, thinning and tearing; and analyze a completed die to provide insights into stamping-production issues such as scrap shedding and material handling.

“Simulation has become an important tool for us,” shares Andras, “as we seek to control the development of our progressive dies and simulate the process during strip development. We can easily flow data back and forth between VISI and Dynaform, to avoid excessive troubleshooting in the press, which can become quite time consuming and costly.

“The real benefit to simulation for us,” stresses Andras: “Creating a robust forming sequence and strip layout that we can pass on to our tool designer and builder with confidence that the die will run in production almost immediately.”

ATD ScanArms to scan intricate stamped parts
ATD uses its ScanArms to scan some of its more intricate stamped parts, “to capture features not easily rendered with a conventional CMM,” Andras says. “We can scan tiny features, enlarge them on the screen and run cross-sections through them for metrology and color mapping of deviations.”

Moving up the learning curve as ATD engineers zero in on the benefits of Dynaform simulations, Andras points to the need to completely understand material properties in order to ensure accurate simulations. We’re talking yield strength coefficient, k, n and r values, yield stress, precent elongation, ultimate tensile, etc.“We are creating our own library of material properties for the alloys we stamp, by sending material samples out for testing,” he says. “These are stored within Dynaform. This practice is particularly critical to accurate simulation results when forming our more sensitive parts.”

Last but not least, engineers working in the ATD design center in Costa Rica employ Dynaform further downstream in the die-development process, to develop press and energy curves for the company. “This ensures we can run specific dies in specific presses,” says Andras. “And, Dynaform can tell us, by calculating forming pressures throughout a tool, where we might need to tweak the tool, by adding nitrogen cylinders for example.”

Scanning Captures Toolmaker’s “Magic”

As much as its new software tools have enhanced the strip- and die-development process at ATD, the firm still must continue to work to overcome challenges related to increased part and assembly complexity, and the slew of new steels finding their into automobiles. Here, more often than not a toolmaker must “work his magic,” says Andras, “and perform handwork on one or more die stations to get a die to run flawlessly in the press.”

Such “magic” often renders die stations notably altered from their original CAD models. The inability to capture the result of these die-development activities often causes die-design data to be inaccurate at best and unusable at worst. In 2002, ATD purchased its first FaroArm capable of scanning form and cutting edges. In 2009, a new FaroArm was purchased, along with a laser scanner to capture the magic. ATD engineers employ the machine to acquire surface data and enable reverse engineering of die surfaces. This device has proven to be so useful that ATD acquired a second ScanArm for its Seville, OH facility. In addition, ATD has added a third machine for its sister facility in China. This allows designs to be easily updated after the tryout and development activity has been completed, which guarantees complete and accurate tool designs for each stamping tool produced.

“The ScanArm helped build our confidence in the simulation software,” explains Andras. “For example, we recently brought in a takeover tool that, when we ran a simulation of the forming operation the software predicted the part would split. But, in reality the die ran just fine in our press. We figured that the form tools did not match the CAD models, and proved that theory by using the ScanArm to scan the form tools. Using PolyWorks (parametric software for 3D metrology/reverse engineering applications), we back-fed the new surface data into Dynaform and ran the simulation again. It was incredible how accurate the revised simulation matched actual results in the press.”

Faro designed the ScanArm to offer users the ability to combine the benefits of contact and noncontact scanning. Its product literature states that “the ScanArm’s hard probe and the Laser Line Probe can digitize interchangeably without having to remove either component. Users can accurately measure prismatic features with the hard probe, then laser scan sections requiring larger volumes of data.”

Andras also explains that ATD uses its ScanArms to scan some of its more intricate stamped parts, “to capture features not easily rendered with a conventional CMM,” he says. “We can scan intricate features, enlarge them on the screen and run cross-sections through them for metrology and color mapping deviations.” MF

See also: ETA Software, Inc., Faro Technologies Inc., Vero Software

Related Enterprise Zones: Quality Control, Software, Tool & Die