Qorvo® To Unveil New RF Solutions at Mobile World Congress 2017

Qorvo’s RF solutions improve device performance and optimize spectral efficiency to accelerate the global adoption of next-generation wireless standards

GREENSBORO, NC – February 22, 2017 – Qorvo® (Nasdaq:QRVO), a leading provider of innovative RF solutions that connect the world, today announced it will showcase its expanding portfolio of radio frequency (RF) solutions at Mobile World Congress (MWC) 2017 in Barcelona. Qorvo offers a breadth of RF solutions unmatched in the industry, from highly integrated power amplifiers, filters, multiplexers and switches to antenna tuners and other high-performance solutions for 4G LTE, LTE-A, pre-5G/5G and IoT applications.

As the growing demand for data and increasing carrier requirements for optimized spectral efficiency drive RF complexity, Qorvo is simplifying connectivity by solving the most critical RF challenges. A pioneer in RF for more than 30 years, Qorvo collaborates closely with the leading carriers, equipment manufacturers, channel partners and smartphone providers to maximize network capacity and accelerate the next generation of wireless networks and devices. During Mobile World Congress 2017, Qorvo will highlight new RF solutions including its high performance RF Fusion™ portfolio, the adaptable and scalable RF Flex™ portfolio and an expanding portfolio of multiplexers and other solutions optimized to solve advanced carrier aggregation (CA) challenges.

Qorvo’s high-performance RF solutions simplify design, reduce product footprint, conserve power, improve system performance and accelerate the adoption of carrier aggregation. Qorvo combines systems-level expertise, broad manufacturing scale, and the industry’s most comprehensive product and technology portfolio to help leading manufacturers accelerate the delivery of next-generation 4G LTE, LTE-A, pre-5G/5G and IoT products. Qorvo’s core RF solutions set the standard for next-gen connectivity, delivering unmatched integration and performance at the heart of the connected world.

Qorvo will showcase the industry’s most comprehensive portfolio of advanced RF Front End solutions at Mobile World Congress (MWC 2017), from February 27 through March 2 in Hall 2, Stand 2i25.

About Qorvo

Qorvo (NASDAQ:QRVO) makes a better world possible by providing innovative RF solutions at the center of connectivity. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including advanced wireless devices, wired and wireless networks and defense radar and communications. We also leverage our unique competitive strengths to advance 5G networks, cloud computing, the Internet of Things, and other emerging applications that expand the global framework interconnecting people, places and things. Visit www.qorvo.com to learn how Qorvo connects the world.

Qorvo is a registered trademark of Qorvo, Inc. in the U.S. and in other countries.

Marvell announced an updated version of its popular 88SS1074 SATA SSD controller in the 88SS1079

At CES, Marvell announced an updated version of its popular 88SS1074 SATA SSD controller in the 88SS1079. There’s no significant change to performance or features as far as we are told, but it moves a few components that were required on the PCB side onto the controller die, saving cost and perhaps to a small extent, power. Fewer components on the PCB will also make layout a bit easier for an M.2 SSD, but the space saved is not so large as to allow for an extra NAND package, We’ve seen the 88SS1074 on popular SSDs such as the Crucial MX300, SanDisk X400 and WD Blue, and we expect the successors to these drives to adopt the 88SS1079. Some SSD vendors may update their products relatively soon to cut costs as soon as possible and to offset the price impact of the ongoing NAND shortage, but at the very least all current users of the ‘1074 controller can be expected to use the ‘1079 when moving to the next generation of 3D NAND that will be hitting the market later this year. This is still a play for cents per GB, so a few cents off the cost of the controller will be helpful, especially for the mid-range SATA SSDs that aim to offer a significant performance boost over DRAM-less designs for a small extra cost.

While we saw a solution using the controller in our meeting with Marvell at CES, we were told to wait for partners to announce their solutions before taking pictures. When we get the 88SS1079 drives in to test, it will be interesting to see if any performance change has occurred (remember, Marvell stated that this should perform the same) or if any power difference to the 88SS1074 is observed due to moving components on die. While no retail SSDs with the new controller have been announced and Marvell cannot comment on their customers’ roadmaps, it shouldn’t take long for manufacturers to integrate the new controller into their designs given the slight hardware changes and the ability to use existing firmware as-is. We expect new products using the 88SS1079 controller to be announced by the middle of this year.

Qorvo® Expands Capabilities of Voice-Activated, Smart Home Assistants

MUNICH, Germany – November 7, 2016 – ELECTRONICA 2016 Qorvo® (NASDAQ: QRVO), a leading provider of innovative RF solutions that connect the world, is helping to advance smart home networking with a radio chip and software that significantly expand the ability of consumers to control their homes with spoken commands.

The GP712 radio chip supports multiple communication protocols in a single-chip design suited to connected-home applications. It was introduced earlier this year by GreenPeak Technologies – now Qorvo’s Low Power Wireless business – and is now in production.

When integrated into Virtual Personal Assistants (VPAs), the GP712 enables the VPA to respond to voice commands and communicate directly with millions of smart-home devices that use ZigBee® and Thread protocols. Previously, a separate gateway was required to connect the VPA speaker with the ZigBee and Thread sentrollers.

VPA-enabled wireless speakers – such as Amazon Echo and Google Home – have microphones that link consumers directly to cloud services using voice commands. According to ABI Research, more than 120 million voice recognition-enabled devices are forecast to ship annually by 2021*.

Cees Links, general manager of Qorvo’s Low Power Wireless business, said, “This new capability allows designers to create more capable voice-controlled smart home assistants that directly support a wider variety of devices and standards. It enhances the user experience, advances the Internet of Things (IoT) and brings us closer to the fully networked home.”

Live demonstrations of smart home applications, as well as other innovative solutions from Qorvo, will be featured at the company’s booth during Electronica in Munich, Nov. 8-11, 2016, Hall A3 Booth #142.

Qorvo’s Low Power Wireless business is one of the leading developers of wireless semiconductor system solutions for connected devices, with a broad range of advanced RF chips and software for smart home data communications and the IoT.

About Qorvo

Qorvo (NASDAQ:QRVO) makes a better world possible by providing innovative RF solutions at the center of connectivity. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including advanced wireless devices, wired and wireless networks and defense radar and communications. We also leverage our unique competitive strengths to advance 5G networks, cloud computing, the Internet of Things, and other emerging applications that expand the global framework interconnecting people, places and things. Visit www.qorvo.com to learn how Qorvo connects the world.

Qorvo is a registered trademark of Qorvo, Inc. in the U.S. and in other countries.
* Voice Integration and Control in the Smart Home, 3Q 2016, ABI Research

Qorvo Smart Home Gateway Platform Earns Industry’s First ZigBee 3.0 Certification

ZigBee-certified solution accelerates adoption of standard-compliant smart home devices

AMSTERDAM, IBC 2016, Netherlands – September 7, 2016 – Qorvo® (NASDAQ: QRVO), a leading provider of innovative RF solutions that connect the world, today announced that its Low Power Wireless business unit (formerly GreenPeak Technologies) is the first in the industry to receive the ZigBee 3.0 certification for its smart home gateway platform. A certified ZigBee 3.0-ready platform enables software developers to quickly integrate the standard into their smart home applications.

ZigBee 3.0 combines the best capabilities of the existing ZigBee smart home profiles in a single unified protocol. It also includes ZigBee Green Power, which supports battery-less, energy harvesting devices. ZigBee 3.0 facilitates communication and interoperability among a wide variety of smart devices for home automation, light control, building automation, retail services, health care and telecommunication services.

“Certified platforms are important tools for ZigBee 3.0 developers,” says Lee Ratliff, principal analyst for connectivity and IoT at IHS Markit. “Platforms such as this allow more companies to participate in the ZigBee ecosystem by reducing complexity and shortening time-to-market for developers. This is especially important for the newly revised ZigBee 3.0 standard which helps address the pent-up demand from developers eager to introduce compliant products.*”

“Receiving the industry’s first ZigBee 3.0 certification underscores Qorvo’s leadership in providing complete solutions for the IoT market,” says Cees Links, General Manager of Qorvo’s Low Power Wireless business unit. “Our ZigBee 3.0 Software Development Kit (SDK) for smart home gateways allows software developers to use a mature and well documented model to deliver solutions quickly and cost effectively. Together, our SDK and Qorvo’s multi-channel and multi-protocol GP712 communication chip enable gateways to handle a variety of different connectivity standards. Developers can now plug in different application protocols as needed. Multiple leading gateway manufacturers have started the development of a ZigBee 3.0 gateway with Qorvo’s GP712.”

The new ZigBee 3.0 SDK for smart home gateways provides an optimized design template enabling a quick system integration. Developers can focus on building a system without needing to dig into the details of the ZigBee 3.0 standard. By incorporating the GP712 radio communication controller chip in the new ZigBee 3.0 SDK for smart home gateways, multi-channel radio support is guaranteed. It allows seamless communication with various sensors, controllers and systems. Its multi-stack protocol capability and the scalable software architecture enable application developers to smoothly integrate current and upcoming standards

IDT and BAE Systems Win Electrons d’Or Award for Space-Grade Chip that Speeds Data Movement in Space

IDT and BAE Systems Win Electrons d’Or Award for Space-Grade Chip that Speeds Data Movement in Space

Contest Sponsor Electroniques Magazine Selected BAE Systems’ RADNET1848PS, Which is Built Upon IDT RapidIO Technology, as Winner in the Military/Aerospace Category

SAN JOSE, Calif., June 29, 2016 – Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI) announced today that a space-grade chip it developed with BAE Systems has won an Electroniques magazine Electrons d’Or Award for 2016. IDT’s RapidIO switch technology serves as the foundation for BAE Systems’ RADNET1848PS radiation-hardened microchip, which won the award in the military/aerospace category.  The chip is designed to help speed the movement of massive amounts of data through a network of radiation-hardened computer systems in outer space.

“Our RapidIO switch technology has a strong foothold in the communications industry and, with its low latency and high scalability, RapidIO is increasingly being used in the most data-intensive applications, such as data centers and high-performance computing,” said Ron Jew, general manager in IDT’s Computing and Communications Division. “Our work with BAE Systems demonstrates that these chips can deliver this same value even within the challenging environmental conditions of outer space.”

The awards ceremony took place in Paris on June 28.

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, timing, wireless power transfer, serial switching, interfaces and sensing solutions are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT is accessible at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, YouTube and Google+.

©2016, IDT. IDT and the IDT logo are trademarks or registered trademarks of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.

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Finisar Introduces 25G Ethernet Optics for High Speed Data Centers and Drives Definition of PAM4 Optics Technology During OFC 2016

Finisar Introduces 25G Ethernet Optics for High Speed Data Centers and Drives Definition of PAM4 Optics Technology During OFC 2016

Finisar Will Also Demonstrate Optical Test Equipment Including WaveShaper and UltraSpan Products

SUNNYVALE, CA — (Marketwired) — 03/22/16 — Finisar (NASDAQ: FNSR) today announced several optics products and technology demonstrations to be held this week during the OFC exhibition. The company will showcase two new products for 25GbE data center applications including an SFP28 eSR transceiver enabling 300-meter links over existing OM3 MMF, and 25G SFPwire®, an Active Optical Cable (AOC) with embedded technology that provides real-time troubleshooting and link performance monitoring. Finisar will also demonstrate optics technology supporting the PAM4 modulation format for Ethernet interfaces at 50 Gb/s per lane. See these demonstrations, including the latest test equipment products, in Finisar’s booth 2305 at the Anaheim Convention Center in Southern California.

25GE SFP28 eSR Transceivers for Data Centers

During OFC, Finisar will feature its SFP28 eSR (extended short reach) transceiver in a demonstration targeting 25G Ethernet data center applications. The new optical module extends links from 70 to 300 meters over existing OM3 multimode fiber (MMF) and enables a seamless upgrade from installed 10GE fiber plant to 25GE. It leverages in-house vertically integrated optics and IC’s and interoperates with current 25GE SFP28 SR and QSFP28 SR4 modules.

The demonstration will show the SFP28 eSR module transmitting 300 meters over OM3 MMF in compliance with the same specification as the 25GE SR module, per the IEEE standard. With this product, customers are able to utilize existing, deployed fiber infrastructure, while increasing network bandwidth by 2.5x over existing 10GE networks, saving significant capital expense.

25G SFPwire AOC with Connectivity Diagnostics

The 25G SFPwire® AOC is the ideal solution for intra- and inter-rack high speed data center interconnections. Designed for ease-of-use, 25G SFPwire® AOCs are lighter, more flexible and lower in power consumption than comparable Direct Attached Copper cables (DACs). Finisar’s VCSEL and IC technology deliver high signal integrity and reliable performance for error-free 25G connectivity. This allows customers the option to by-pass the host FEC, for non-standard, low-latency connections, which is not possible with comparable DACs.

The embedded Connectivity Diagnostics(TM) technology provides data centers with real-time performance monitoring of the 25G SFPwire AOCs, through both a host-software interface and physical indicators on the AOC pull-tabs. The only technology of its kind in the industry, Connectivity Diagnostics provides critical information used for troubleshooting, link performance monitoring and port-connectivity mapping.

The booth demonstration will show multiple 25G SFPwire® AOCs operating between two switches. Innovative Connectivity Diagnostics features will be demonstrated without affecting data traffic.

Driving the Definition of PAM4 Optics Technology

PAM4 is a modulation format that has been adopted by the Ethernet Standards for 50 Gb/s per lane signaling, and will become the building block for future 50GE, 100GE, 200GE and 400GE interconnects. PAM4 presents a significant and challenging transition for the optical interconnect industry, driving an industry-wide re-assessment of link budgets, optical components and transceivers in order to implement PAM4 optical technology in an open, standards-driven way.

Finisar is excited to lead the definition and development of PAM4 optical technology for both shortwave (SW, multimode) and longwave (LW, single mode) applications. The PAM4 Optical Technology demonstration, located in both Finisar and Ethernet Alliance booths, will showcase Finisar DML technology transmitting two channels of 50 Gb/s PAM4 on the CWDM grid over 10km of SMF. Hosted within Juniper and Spirent systems in the EA booth, this is the first interoperability demonstration using DML technology to transmit Nx50 Gb/s PAM4. Finisar DML technology, in both SW and LW implementations, will be critical for the success of PAM4 modulation especially in higher loss-budget implementations such as large data center interconnects with multiple patch-panels.

“Finisar is pleased to share our latest 25GE product innovation and PAM4 technology achievements with our customers at OFC,” said Todd Swanson, EVP of Global Sales & Marketing at Finisar. “We remain focused on developing a broad portfolio of optical technologies and leading-edge optical modules that our customers require to be successful in their end markets.”

Test Instrument Portfolio

Finisar is also demonstrating new capabilities of the WaveShaper® and WaveAnalyzerTM test equipment portfolio in combination with the UltraSpan® broadband source. The WaveShaper 16000S demonstrates broadcasting to 16 ports, each with individual amplitude and phase filtering. The WaveAnalyzer demonstrates triggered spectral measurements as they are required, for example, in a recirculating loop setup. These demonstrations are supported by Finisar’s new UltraSpan® broadband source which provides a powerful and flat ASE signal across the C-band.

About Finisar

Finisar Corporation (NASDAQ: FNSR) is a global technology leader for fiber optic subsystems and components that enable high-speed voice, video and data communications for telecommunications, networking, storage, wireless, and cable TV applications. For more than 25 years, Finisar has provided critical optics technologies to system manufacturers to meet the increasing demands for network bandwidth and storage. Finisar is headquartered in Sunnyvale, California, USA with R&D, manufacturing sites, and sales offices worldwide. For additional information, visit www.finisar.com.

Finisar-G

MEDIA CONTACT:
Victoria McDonald
Director, Corporate Communications Finisar Corporation
+1 (408) 542-4261 press@finisar.com

Source: Finisar
News Provided by Acquire Media

IDT to Present Latest Sensing Technology at SENSOR+TEST 2016

SAN JOSE, Calif., April 26, 2016 – Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), announced today that it will exhibit its advanced sensing technology next month at SENSOR+TEST 2016 in Nurnberg, Germany. The company will showcase leading sensing products developed by ZMDI, a German company it acquired in December. The event, which runs May 10-12, takes place at the Nurnberg Exhibition Centre, and IDT will be at booth 5-217.

Products IDT will demonstrate include various environmental and automotive sensing solutions based on the latest standard IC developments, such as:

  • High-precision magneto resistive position sensors
  • High-temperature sensing product with a temperature range up to more than 1000°C
  • Arc fault detection for photovoltaic installation

IDT will also demonstrate mobile sensing products, including recently released products such as a UVA/UVB sensor and a UV and ambient light sensor, as well as sensing products that measure proximity, gas, humidity and barometric pressure.

SENSOR+TEST is a key event for anyone interested in sensing technology, and this year we will be demonstrating a wide array of high-performance, high-value products,” said Frantz Saintellemy, vice president of IDT’s Automotive and Industrial Division. “This technology is ideal for cutting-edge mobile products in the consumer, industrial, medical and automotive industry applications.”

During the event IDT will have technical and sales representation as well as senior executives in attendance. Attendees interested in meeting with an IDT representative can complete this short web form. IDT is also offering a free one-day ticket to the show which can be obtained here.

About IDT

Integrated Device Technology, Inc. develops system-level solutions that optimize its customers’ applications. IDT’s market-leading products in RF, timing, wireless power transfer, serial switching, interfaces and sensing solutions are among the company’s broad array of complete mixed-signal solutions for the communications, computing, consumer, automotive and industrial segments. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT is accessible at www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, YouTube and Google+.

Versatile Solution: Modular Rear Axle System by ZF

Innovative passenger car axle combines driveline and chassis technology in a single system

  • Can be upgraded in accordance with customer requirements by adding an electric or conventional drive module as well as Active Kinematics Control (AKC) rear axle steering
  • Can easily be used as a variant to the twist beam axle or link SLA axle

Friedrichshafen. The ability to offer driveline and chassis technology from a single source has always been one of ZF’s major strengths – especially in the e-mobility era. ZF uses a new modular rear axle concept to demonstrate how a modular system architecture translates into even greater customer benefits. This innovative solution enables a vehicle with a twist beam axle or link SLA rear axle to be converted easily to a steerable rear axle concept with just a few modifications to the body. This is based on a non-driven basic axle in which an electric axle drive or a conventional rear axle drive as well as the AKC rear axle steering can be integrated, depending on customer requirements. Thus, vehicle manufacturers can respond extremely flexibly to various market requirements with just one body variant.

“With the new rear axle system, we are offering our customers wide-ranging applications in disparate vehicle segments. The solution can be used in hybrid, fuel-cell, and battery-powered vehicles and can be combined with conventional all-wheel modules or with our active rear axle steering AKC,” explains Uwe Coßmann, Head of the ZF Car Chassis Technology division. Development costs are also reduced considerably for automotive manufacturers: ZF handles the individual coordination of the internal interfaces in the axle construction kit.

The basic axle entails a modular further development of a Semi-Trailing Arm Rear Suspension (mSTARS). As part of this setup, the rear of the two outboard kinematics points of the lower control arm were replaced with an integral link and a toe link added. The toe link defines the track across the wheel hub and enables the toe-in to be adjusted precisely. As an alternative to a suspension strut, which tends to be used on semi-trailing link axles, the integral link in an extreme outboard position enables separate springs and dampers to be used. This solution tends to be cheaper and also provides more width between the wheel arches in the trunk.

Integrated electric axle drive system

The basic axle can be combined, for instance, with the electric drive module positioned centrally on the axle; this module features an electric motor configured as a high-revving asynchronous motor. The electric motor, the single-speed transmission with differential, housing, and cooling unit, as well as the power electronics complete with control software form an integrated, extremely compact unit.

Steering impulses from the rear

The basic axle can also be combined with ZF’s AKC (Active Kinematics Control) rear axle steering. In this case, the rear wheels actively assist the front steering angle and the passenger car enjoys enhanced agility or stability, depending on the road speed, when changing direction.

Tips For Developing An Effective BI Roadmap

By Sat Kana – BI Practice Lead

Business Intelligence (BI) tools are effective only when they are able to meet the major three key expectations of any business. What are those expectations and how to prepare an effective BI roadmap is what you are going to learn in this blog.

What are the 3 key expectations of businesses from their BI Solution?

Every BI manager must be aware of the 3 most important expectations of any business group. A business expects its BI infrastructure to provide:

  1. Availability of Data- When does relevant data become useful? When it is readily accessible whenever required. Data being available within a business but not accessible for effective decision making is deemed useless.
  2. Reliability of Data- Inappropriate data leads to inappropriate decisions. Hence, ensuring data quality is important for effective decision making.
  3. Completeness of Data- Incomplete data only facilitates partial comprehension of truth. This hinders holistic understanding of data which is crucial for effective decision making.

Therefore, Availability of Data, Reliability of Data and Completeness of Data act like 3 gears which support each other to enhance overall organizational efficiency. They do so by effectively streamlining processes from data delivery to data governance. The explanation is beautifully portrayed in the illustration below-

BI Roadmap

If the BI Solution fails to do justice to even one of the above 3 aspects, the business fails to take the right decisions. Do you know what makes a complete BI Solution? The right BI tools. However, it is very easy to get confused considering the wide pool of BI tools available. If you want to learn to be able to integrate the right BI tools to enhance your business productivity, contact us to set up a complimentary consultation, we’re happy to help!

You should be now pretty well acquainted with the 3 key expectations your BI solution must meet for effective decision making.

Now let’s understand how BI managers can ensure perfect match with their target organizational goals?

The solution is to develop a BI Strategy or BI Roadmap. This will give your BI activities the required structure and a focus.

What does a Business Intelligence (BI) Roadmap include?

The BI Roadmap includes creating a BI framework. This framework supports not just architectural components but also includes the overall processes and technologies which hold the components together.

Below are the essential tips to develop an effective BI Roadmap:

  1. Alignment of goals– List down your business goal and IT goal next to each other. Now ensure that the BI or IT goals are in alignment to your organizational objectives.
  2. Design a “Levels of Analytics” blueprint- Creating such a blueprint is crucial to determine the effectiveness of your current BI architecture. It is an enhanced visual representation of how your business currently accesses data for analysis and reporting; what improvements can or must be made? It will also show you the different data needs across diverse business groups and divisions. In easy words, a Level of Analytics blueprint displays the level and effectiveness of your organizational BI maturity.

Have a look at the below illustration and you will know how valuable it is-

BI Reports

How does the Level of Analytics (LOA) blueprint help your business?

The LOA blueprint is feasibly the most effective and easiest way to help your business grow because:

  • You get to know the business problems instantly. Also you become aware of different business groups facing different issues in accessing data for analysis and reporting. In simple terms, the shortcomings of your current BI system are transformed into valuable assets.
  • You will easily be able to foresee challenges and risks and instantly develop a contingency plan. This will help you mitigate or evade any losses and add to your organizational revenues.

Qorvo Drives GaN into Ka-band to Improve Satellite Internet

High Frequency GaN Enables VSAT Power Efficiency Improvements

PARIS, FRANCE – September 8, 2015 – Qorvo™, Inc. (Nasdaq: QRVO), a leading provider of RF solutions for mobile, infrastructure and aerospace/defense applications, today announced a new highly cost effective, high performance Ka-band 3 watt GaN power amplifier for commercial VSAT satellite ground terminals transmitting high speed internet data.

“Qorvo’s 0.15um high-frequency GaN process delivers three times the power density of past generation GaAs pHEMT solutions. With unmatched, power, device gain and reliability, the technology is ideal for both saturated and linear high power amplifier for Ka-band satellite ground terminal transmit applications,” said Gorden Cook, general manager of Qorvo’s transport business unit. “Supporting both saturated and linear applications, the TGA2636-SM delivers 3 watts of peak output power for traditional saturated power VSAT ground terminal applications, and when operated in a ‘linear power back-off mode’ required for higher–order modulation systems, enables more effective use of the Ka-band spectrum, resulting in higher data rates delivered to the user.”

The TGA2636-SM GaN PA is fabricated utilizing Qorvo’s 0.15-micron gallium nitride on silicon carbide (GaN on SiC) process, and operates across a 28 – 31 GHz frequency range while delivering 3 watts of saturated output power and 25dB linear gain at 30% power-added efficiency (PAE) in a compact 5x5mm surface mount package.

Qorvo’s new GaN VSAT power amplifier will begin sampling in the current quarter 2015, with production quantities available in the first quarter of calendar 2016.

Qorvo is showcasing its GaN power amplifiers at stand C307 at European Microwave Week, September 8-10 at the Palais de Congrès in Paris, France.

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